| 摘要 |
PURPOSE:To prevent the surface of a wafer from being stained with rinsing solution by a method wherein a backside rinsing nozzle to jet the rinsing solution in the wafer turning direction is provided. CONSTITUTION:When the backside of wafer 1 is rinsed after finishing development, the upward rinsing force is remarkably reduced because of the longer distance from the rinsing position to the end of wafer with little rinsing solution reaching one end of wafer. In such a constitution, the rinsing solution can not stick on the surface of wafer since the rinsing solution can not reach the upper part of wafer even if the rinsing solution can reach the orientation flat 15. |
