| 摘要 |
<p>PURPOSE:To provide a resin sealed semiconductor device which is excellent in moisture resistance, bonding property, and low stress property with no exfolia tion crarks on the element or sealing at the boundary of the element and the substrate by sealing a semiconductor device and the surroundings thereof with a specific composition thermosetting resin composition. CONSTITUTION:A semiconductor device 3 is die-bonded onto a circuit part 2 formed on the surface of an insulating substrate 1 with conductive paste or an adhering tape 4, and then a bonding pad 5 being an electrode of the semiconductor device 3 and the circuit part 2 are interconnected through a bonding wire 6. For protecting the circuit part 2 and the semiconductor device 3 so interconnected through the wire bonding they are sealed with a thermosetting resin composition including as essential components bis-maleimide derived from di-amino siloxan represented by a formula I and an epoxidized product of 1,2-polybutadiene represented by a formula II. Hereby, there is ensured a high reliability semiconductor device in which exfoliation and cracking are eliminated at an interface between the semiconductor device and the substrate.</p> |
