MANUFACTURE OF SEMICONDUCTOR CHIP PACKAGE,申请号JP19910153107-传众专利搜索

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发明名称	MANUFACTURE OF SEMICONDUCTOR CHIP PACKAGE
摘要
申请公布号	JPH053273(A)	申请公布日期	1993.01.08
申请号	JP19910153107	申请日期	1991.06.25
申请人	KYOCERA CORP	发明人	ISHIBASHI TOKUKAZU;NIITOME JUNICHI
分类号	H01L23/08;H01L23/36;H01L23/40	主分类号	H01L23/08
代理机构		代理人
主权项
地址

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