| 摘要 |
PURPOSE:To provide a semiconductor device possessing varieties of resistances even when bonding is carried out with the use of a bonding wire of one kind by depositing on bonding wires a film having a specific resistance lower than said bonding wires of the parts among many bonding wires. CONSTITUTION:A conductive pad 12 formed in an integrated circuit chip and a lead terminal 8 connected to an external circuit are interconnected with use of a bonding wire 18 covered partly with a coated film 20. The coated film 20 includes a conductive bonding agent having lower resistance than the bonding wire 18 which is yielded by blending As, Au, etc., in a bonding agent for example. Resistance between the conductor pad 12 and the lead terminal 8 is defined in response to the thickness and length. etc., of the coated film 20. Accordingly, even though the bonding wire 18 is of one kind in itself, a semiconductor device possessing varieties of resistances is ensured between the conductor pad 12 and the lead terminal 8 depending upon the existence of the coated film 20 or by controlling the thickness and length of the bonding wire on which the coated film 20 is deposited. |
