| 摘要 |
PURPOSE:To improve the hallowing resistance of oxidated inner layer copper by constituting the adhesive composition for a printed wiring board out of thermosetting resin and alkaline metallic carbonate or alkaline rare earth metallic carbonate. CONSTITUTION:Thermosetting resin such as epoxy resin, phenol resin, etc., and alkaline carbonate such as lithium carbonate, sodium carbonate, magnesium carbonate, etc., or alkaline rare earth metallic carbonate are used. Though mixture quantities of thermosetting resin and carbonate are not specified, carbonate is approximately 20-150wt. portion against 100wt. portion for thermosetting resin. And a harder and further a hardening accelerator are mixed at need to the adhesive composition constituted this way. Hereby, the hollowing resistance of the oxidated inner layer copper can be improved remarkably, and also it can be made a binder for a printed wiring board favorable in electric insulation. |
