| 摘要 |
PURPOSE:To improve the hollowing resistance of oxidated inner layer copper by constituting the adhesive composition part for a printed wiring board out of thermosetting resin and alkaline metallic carbonate whose surface is hydrophobically treated or alkaline rare earth metallic carbonate whose surface is hydrophobically treated. CONSTITUTION:Thermosetting resin such as epoxy resin, phenol resin, etc., and alkaline carbonate whose surface is hydrophobically treated such as lithium carbonate, sodium carbonate, magnesium carbonate, etc., or alkaline metallic carbonate whose surface is hydrophobically treated are used. For mixture quantity, it is not specified, but carbonate is 200-150wt. portion against 100wt. portion for thermosetting resin. And a harder and further a hardening accelerator are mixed at need to the adhesive composition constituted this way Hereby, the hollowing resistance of the oxidated inner layer copper can be improved remarkably, and also it can be made a binder for a printed wiring beard favorable in electrical insulation reliability. |
