| 摘要 |
PURPOSE:To test a semiconductor chip forming an LSI when the chip is in the form of a wafer by a method wherein a probe is fixed to the both sides of a supporting substrate. CONSTITUTION:Wiring 2 is provided on the both sides of an insulated substrate 8, and a probe 3 divided into two groups is fixed to each side. Therefore, even if circuit electrodes are arranged in two rows on a highly integrated chip, it is unnecessary to increase the number of installation surfaces for fixing the probe to the substrate 8. For this reason, erroneous operation originating in the extended length of the probe can be avoided, while high speed and highly accurate teasting is made possible. |
