| 摘要 |
PURPOSE:To provide the subject composition (heat resistance temperature of 150 deg.C or above) which is a generally difficultly moldable polyphenylene other resin composition markedly improved in injection moldability, has till good moldability even when filled with a large amount of conductive carbon black and can easily be molded at a heat distortion temperature (18.5kg/cm<2>) at which it has been heretofore difficultly moldable. CONSTITUTION:A heat-conductive resin composition comprising 100 pts.wt. polyphenylene ether resin composed of 50-92wt.% polyphenylene ether polymer and 50-8wt.% polystyrene polymer, 5-15 pts.wt. ethylene/acrylic acid ester copolymer, 0.8-2.9 pts.wt. maleic anhydride-modified polyolefin polymer and 7-45 pts.wt. conductive carbon black. |
