发明名称 |
Low resistance probe for semiconductor |
摘要 |
A probe (10) that can be used for forming a low resistance electrical connection to a semiconductor die includes a contact (18) that is created on a compliant layer (12) which is supported by a substrate (11). Pressure applied to the contact (18) compresses the compliant layer (11) which causes a distal end of the contact (18) to move in a motion that is substantially equal to an arc. As the contact (18) moves through the arc motion, it scrubs across a bonding pad of a semiconductor die and breaks through oxide that typically forms on the bonding pad thereby forming a low resistance electrical connection to the bonding pad.
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申请公布号 |
US5177438(A) |
申请公布日期 |
1993.01.05 |
申请号 |
US19910739576 |
申请日期 |
1991.08.02 |
申请人 |
MOTOROLA, INC. |
发明人 |
LITTLEBURY, HUGH W.;SIMMONS, MARION I. |
分类号 |
G01R1/067 |
主分类号 |
G01R1/067 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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