发明名称 MATERIAL FOR MOLD AND PROCESS OF FORMING MOLD BY USING THIS MATERIAL
摘要 PCT No. PCT/JP89/00859 Sec. 371 Date Apr. 12, 1990 Sec. 102(e) Date Apr. 12, 1990 PCT Filed Aug. 23, 1989 PCT Pub. No. WO90/02007 PCT Pub. Date Mar. 8, 1990.A material for a mold which comprises, as main components, a refractory aggregate and a hardenable binder comprising a polyfunctional acrylamide having at least two ethylenically unsaturated groups in the molecule, has an excellent low-temperature rapid hardenability, disintegrability, and pot life and is especially suitable as a material for a mold for casting a low-melting-point metal such as an aluminum alloy.
申请公布号 US5177140(A) 申请公布日期 1993.01.05
申请号 US19900474037 申请日期 1990.04.12
申请人 ASAHI YUKIZAI KOGYO CO. LTD. 发明人 OGAWA, FUMIYUKI;TOMINAGA, KYOUJI;OTA, YOSHIOMI;KAI, ISAO;TAMEMOTO, KAZUO;OSADA, MITSUHIRO
分类号 B22C1/22 主分类号 B22C1/22
代理机构 代理人
主权项
地址