| 摘要 |
The invention relates to a process for manufacturing fiber-reinforced boards for the electrical industry by the use of epoxy resins and latent curing agents based on imidazole/acrylic acid reaction products based on the general formula <IMAGE> (I) wherein R, R1 and R2 are, independently of one another, H or a short-chain alkyl group having from 1 to 3 carbon atoms, R3 is a group of the formula -O-(CH2)m-R4(II) wherein m is an integer between 2 and 6, R4 is H, -OH or -O-, and n is equal to the valence of R3.
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