发明名称 FORMULATION OF ACTIVATING SUBSTRATE SURFACES FOR THEIR ELECTROLESS METALLIZATION
摘要 Formulations containing an organometallic activator, a filler, a special mixture of organic solvents and a PU elastomer are eminently suitable for activating plastic surfaces for their electroless metallization avoiding stress-corrosion cracking. The plastic parts so activated are preferably used for screening from electromagnetic waves after metallization has been carried out.
申请公布号 US5176743(A) 申请公布日期 1993.01.05
申请号 US19910696431 申请日期 1991.05.06
申请人 BAYER AKTIENGESELLSCHAFT 发明人 REICHERT, GUENTHER;GIESECKE, HENNING;WOLF, GERHARD D.
分类号 C23C18/30;C23C18/28;H05K3/18;H05K3/38 主分类号 C23C18/30
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