发明名称 |
FORMULATION OF ACTIVATING SUBSTRATE SURFACES FOR THEIR ELECTROLESS METALLIZATION |
摘要 |
Formulations containing an organometallic activator, a filler, a special mixture of organic solvents and a PU elastomer are eminently suitable for activating plastic surfaces for their electroless metallization avoiding stress-corrosion cracking. The plastic parts so activated are preferably used for screening from electromagnetic waves after metallization has been carried out.
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申请公布号 |
US5176743(A) |
申请公布日期 |
1993.01.05 |
申请号 |
US19910696431 |
申请日期 |
1991.05.06 |
申请人 |
BAYER AKTIENGESELLSCHAFT |
发明人 |
REICHERT, GUENTHER;GIESECKE, HENNING;WOLF, GERHARD D. |
分类号 |
C23C18/30;C23C18/28;H05K3/18;H05K3/38 |
主分类号 |
C23C18/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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