| 摘要 |
A thermal conduction module for cooling an array of integrated circuit chips mounted on a substrate includes a moveable piston for cooling the chips, the piston having a base, urged against an upper surface of the chips, of thermally conductive material. The base has on the lower surface thereof cups or channels between adjacent rows of the chips, and, on the upper surface thereof, parallel channels directly over the chips. The piston includes members extending downward into the upper surface channels for directing a flow of coolant into the upper surface channels and impinging the coolant on the channel bottoms. The flow directing members may be plate-like baffles or nozzles. The piston also includes passages for directing coolant from one upper surface channel to an adjacent upper surface channel in a flow direction perpendicular to the axes of the upper surface channels.
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