发明名称 METHOD OF MOUNTING REFINED CONTACT SURFACES ON A SUBSTRATE AND SUBSTRATE PROVIDED WITH SUCH CONTACT SURFACES
摘要 A method for mounting contact surface elements on the ends of strip conductors along the edge of a substrate (1). A solder mixed with adhesive is applied to the soldering surface (10) at ends of the strip conductors. Contact surfaces (2) each having a refined, f.i. gold plated, top surface and an activated, f.i. tin plated, bottom surface, are placed respectively on each soldering surface (10). Heat is applied to melt the solder particles and provide a good electrical connection between each surface contact (2) and strip conductor. The substrate mounted with the contact elements has a plurality of components mounted on one surface thereof and interconnected by the strip conductors. The substrate is adapted to be plugged into an edge connector (3) along its edge with the mounted contact surface elements (2).
申请公布号 HK105192(A) 申请公布日期 1992.12.31
申请号 HK19920001051 申请日期 1992.12.24
申请人 E.I. DU PONT DE NEMOURS AND COMPANY 发明人 VERHOEVEN, LAURENTIUS MARIA
分类号 H01R43/02;B23K1/00;H05K1/11;H05K3/24;H05K3/30;H05K3/34;H05K3/40;(IPC1-7):H05K1/11 主分类号 H01R43/02
代理机构 代理人
主权项
地址