| 发明名称 |
Electroplating process and composition. |
| 摘要 |
<p>A process for electroplating a nonconducting substrate comprising formation of a catalytic metal sulfide on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The catalytic metal chalcogenide is preferably palladium sulfide.</p> |
| 申请公布号 |
EP0520195(A2) |
申请公布日期 |
1992.12.30 |
| 申请号 |
EP19920108801 |
申请日期 |
1992.05.25 |
| 申请人 |
SHIPLEY COMPANY INC. |
发明人 |
BLADON, JOHN J. |
| 分类号 |
C23C18/30;C25D5/54;C25D7/00;H05K1/05;H05K3/18;H05K3/42 |
主分类号 |
C23C18/30 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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