发明名称 |
AUTOMATIC WAFER LAPPING APPARATUS |
摘要 |
An automatic wafer lapping apparatus in which a pair of turntable stages are provided which each have a vertical central shaft and a pin on which the wafer carriers are spitted and piled up; furthermore, the teeth of the sun gear and the internal gear of the lapping assembly are bevelled at their upper portions in a manner such that the upper end of each tooth is tapered and converge into a linear ridge so as to facilitate automatic and prompt meshing of the carriers inbetween them.
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申请公布号 |
US5174067(A) |
申请公布日期 |
1992.12.29 |
申请号 |
US19910779474 |
申请日期 |
1991.10.18 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
HASEGAWA, FUMIHIKO;HASHIMOTO, HIROMASA |
分类号 |
B24B37/04;B24B37/34;H01L21/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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