| 摘要 |
A flexible sheet material and bags made therefrom for packaging electrostatically sensitive items such as electronic circuit boards. The sheet has a metal layer that is adhesively laminated to an antistatic polymeric layer, the instant bag being of improved metal layer to antistatic layer adhesion. The metal outer surface of the bag has a high non-conductive surface resistivity greater than or equal to 108 ohms/square, yet the bag protects the packaged item from static voltage by preventing the capacitive coupling of the voltage through the bag to the item packaged therein.
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