| 摘要 |
PURPOSE:To enhance reliability by reducing in size a tape carrier type semiconductor device and reducing an inductance a lead. CONSTITUTION:A conductor plate 11 is provided on a semiconductor chip 5. The plate 11 is composed of a sublead 14 connected to an electrode (ground electrode 15) to be the same potential, and a ground lead 13 adjacent to an external connection lead 2. The electrode 15 can be alternately electrically connected by the plate 11, and gathered by the plate 11. Thus, the number of the entire leads is reduced to reduce a package size, and the connection lead is shortened to reduce an inductance of the lead. |
