发明名称 WAFER SEALING RING ATTACHING/DETACHING DEVICE
摘要 <p>PURPOSE:To provide a device in which a manual work is reduced, a sealing ring can be automatically simply and rapidly attached or detached with less fear of contaminating a wafer by providing special temperature adjusting plate, elevator and sealing ring guide. CONSTITUTION:A wafer sealing ring 11 made of a rubber ring and having a structure in which an opening width of an annular groove and an inner diameter of the ring can be varied due to a temperature change, is attached to or detached from a wafer 14. Such a device has a surface for mounting the ring 11, temperature adjusting means for varying the temperature of the ring 11, and an annular temperature adjusting plate 25 having a hollow part through which a wafer stage 26 can be passed. Further, the device has the stage 26 for mounting the wafer 14 mounted or non-mounted with the ring 11, an elevator 28 having a vertically moving mechanism 27 vertically moving through the hollow part of the plate 25, and a sealing ring guide 29 covering the ring 11 mounted on the plate 25 from above.</p>
申请公布号 JPH04372150(A) 申请公布日期 1992.12.25
申请号 JP19910176142 申请日期 1991.06.20
申请人 TOSHIBA CORP;TOSHIBA MICRO ELECTRON KK 发明人 ASAKURA SHIGEAKI;YOSHINAKA HITOSHI;SAKAYA KAZUHIRO
分类号 B65G47/52;H01L21/68;H01L21/683 主分类号 B65G47/52
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