| 摘要 |
PURPOSE:To improve the pattern recognizing ability of an electrode or a bonding pad by uniformly etching the surface of the electrode section consisting of Al or an Al alloy by the aqueous solution of hydrofluoric acid or ammonium fluoride and roughening it. CONSTITUTION:An Al film or an Al alloy film is formed onto a semiconductor substrate 1, and patterning through a photoetching method and heat treatment are executed. Etching is performed by the aqueous solution of hydrofluoric acid or ammonium fluoride or the mixed liquid of both before a heat treatment process at that time. Consequently, the surfaces of electrodes 7 composed of Al or an Al alloy or bonding pads are roughened. Accordingly, the pattern recognizing ability of the electrodes 7 or the bonding pads is improved. |
