| 摘要 |
PURPOSE:To simplify a semiconductor device and to reduce an inductance thereof by increasing the degree of freedoms of a wiring pattern. CONSTITUTION:Side edge electrode pads 2a are not only arranged on a side edge region of a semiconductor chip 1 but also an inner electrode pads 2b are arranged on an inner region of the chip 1, as electrode pads to be arranged on the chip 1, inner leads 10a of inwardly extending leads 10 are disposed in the vicinity, and the pads 3b are electrically connected, for example, by using bonding wires 11. The leads 10 are formed on a surface of an insulating film 9 formed on the chip 1. |
