| 摘要 |
PURPOSE:To improve the mounting speed of an electronic parts mounting method and its device for mounting electronic parts on a printed board and, prevent the electronic parts from being damaged by the mounting operations by taking out the electronic parts from a tray, emboss tape, etc., by suction. CONSTITUTION:This electronic parts mounting method mounts electronic parts 4 housed in a parts housing section 30 in such a way that the parts 4 are picked up and carried to a prescribed position on a printed board 6 by suction by means of the suction nozzle 10 of a parts mounting head 1 and, upon arriving at the prescribed position, the parts 4 are mounted on the board 6 by relieving the suction of the nozzle 10. A guide block 11 which mechanically aligns the parts 4 is provided on the outside of the nozzle 10 and the parts 4 are positioned along the internal surfaces 11a and 11b of the block 11 by relatively moving the nozzle 10 against the block 11 in the vertical direction after the parts 4 is attracted to the nozzle 10 by suction. |
