GEGOSSENES KUNSTSTOFF-CHIP-GEHAEUSE MIT STECKERMUSTER.

摘要

An improved plastic molded chip carrier package for a semiconductor chip [1,40] has a plurality of I/O pins [20,60] arranged on a pin grid array. The pin grid array comprises at least two row of the I/O pins [20,60] disposed along the sides of the chip [1,40] in such a manner that the I/O pins [20,60] are staggered with respect to those in the other row. The staggered arrangement of the I/O pins [20,60] makes it easy to provide electrical interconnection between the I/O ports on the chip [1,40] and the corresponding I/O pins [20,60] without requiring an elaborate or crowded wiring or connection lines. This is particularly effective when an increased number of the I/O pins [20,60] are required to be included in the limited area of the chip carrier.