| 摘要 |
PURPOSE:To enable a structure to be reinforce, a machining man-hour to be reduced for saving labor, and a productivity to be improved by forming a groove which is used as a gas passage at one semiconductor substrate and performing pattern-formation of only a pair of heat wires at the other semiconductor substrate. CONSTITUTION:A lower-side semiconductor substrate 1 where only a pair of heat wires 51 and 52 are subjected to pattern-formation and an upper-side semiconductor substrate 2 where a groove 40 which is used as a gas passage 40 is subjected to etching-formation are adhered overlappingly so that the wires 51 and 52 are placed in the passage 4, thus constituting a sensor body. In this manner, since the groove 40 is formed only at the substrate 2, a machining man-hour is reduced and at the same time a time for an alignment can be saved when the substrate 1 is jointed to the substrate 2 to form the passage 4, thus enabling productivity to be improved. |
