| 摘要 |
PURPOSE:To provide the method and apparatus for face down bonding by which an appropriate bonding can be available at all times, concerning the method and apparatus for face down bonding by which a bonding condition can be identified. CONSTITUTION:In the method for face down bonding of an electronic component or printed wiring board (hereinafter simply called 'electronic component') 3 and another electronic component 4 through bumps 5a, 5b, a difference is made in temperatures between the one electronic component 3 and the other electronic component 4 and a bonding condition at the time of bonding the bumps 5a, 5b of the two electronic components 3, 4 is identified by an infrared camera 1. When the two electronic components 3, 4 abut each other, heat is transmitted to the infrared camera 1. Consequently, the size of images of the bumps 5a, 5b when the bonding condition of the upper and lower bumps 5a, 5b is appropriate differs from the one when the bonding condition in inappropriate. |
