| 摘要 |
<p>The invention is for the formation of multilayer circuit boards where layers (3, 5) are formed sequentially using selective plating techniques and imaging of dielectric materials (3) to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using imaging techniques. The method may also be used in single-sided and double-sided circuit board fabrication and for inner layers used in multilayer circuit boards.</p> |
