发明名称 Both-side roughened copper foil with protection film.
摘要 <p>Disclosed is a both-side roughened copper foil with a protection film, comprising a metal foil as soft as or softer than copper, or an organic type film having a melting point equal to or higher than a lamination temperature, laminated on one side of a copper foil with both sides roughened, the metal foil or organic film being continuously or continually bonded or adhered to the copper foil. It is possible to protect the ruggedness on the roughened surface at the time the both-side roughened copper foil is cut, packed, transported or stacked on another both-side roughened copper foil, simplify the press molding work, and improve the production efficiency particularly in the step of fabricating a copper-clad laminated board for a printed circuit board as well as the quality of the acquired copper-clad laminated board.</p>
申请公布号 EP0519631(A2) 申请公布日期 1992.12.23
申请号 EP19920305243 申请日期 1992.06.08
申请人 SUMITOMO BAKELITE COMPANY LIMITED;CIRCUIT FOIL JAPAN CO. LTD 发明人 KEIJI, AZUMA;KIMIKAZU, KATOH;RYOICHI, OGURO
分类号 H01B5/02;H05K1/09;H05K3/02;H05K3/38;H05K3/46;(IPC1-7):H05K3/46;H05K3/28 主分类号 H01B5/02
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