| 摘要 |
PURPOSE:To prevent bonding failures by the observation of the size of a wire ball. CONSTITUTION:A wire bonding apparatus is constituted of an X-Y table 1 which is movable in X and Y directions; a drive section 2 mounted on the X-Y table 1; a horn 3 projecting from the drive section 2; a capillary tool 4 disposed at the tip end of the horn 3, and through which a wire 5 passes; a torch 6 for producing a ball B at the lower end of the wire 5 which is fed from the capillary tool 4; and a camera 7 for monitoring a board 12 or a chip P from the top thereof. Optical path changeover switch means 8 and 10 are arranged below the camera 7, and hence the camera 7 can monitor any one of the ball B, the board 12 or the chip P by switching the changeover switch means 8 and 10. |
