| 摘要 |
PURPOSE:To provide an IC package where signal light is inputted or outputted through both its surfaces and an photoelectric IC module structure provided with the IC packages which can be mounted high in density. CONSTITUTION:A first wiring metal 17 provided with a window 19 for signal light is deposited on a transparent package substrate 16, and a mesa-shaped photoelectric IC provided with a light emitting element of a photodetective element is mounted thereon. An electrode 22 is deposited on the top of a mesa 21, and the electrode 22 is bonded to the first wiring metal 17. A part of the top of the mesa 21 where the electrode 22 is not deposited is aligned with the window 19 of the first wiring metal 17, output light 26 emitted from the mesa 21 is outputted from the package 16 through the window 19. Input light 25 is made to impinge on the rear side of the IC substrate 20. |
