| 摘要 |
<p>PURPOSE:To provide a technique of manufacturing a semiconductor device, where the control of a wafer process can be effectively and accurately carried out without being affected by the surface state of a semiconductor wafer. CONSTITUTION:The discrimination data Wa of a semiconductor wafer, the arrangement data Wx of semiconductor devices X formed on the front side of the semiconductor wafer W, and data such as al-ignment marks M used for drawing patterns and the like are formed on the rear side of the semiconductor wafer W, and then the control of a wafer process is controlled basing on the data formed on the rear side of the wafer for recording.</p> |
