| 摘要 |
PURPOSE:To provide a method of manufacturing a glass-ceramic multilayer circuit board where a pore-free good via can be formed even if the via is as small in diameter as 100mum or so. CONSTITUTION:Mixed powder of copper powder compounded with ceramic powder is filled into a through-hole provided to a glass-ceramic green sheet at a via forming predetermined position, and then conductor paste is printed on the green sheet for the formation of a conductor pattern. A laminate composed of the laminated green sheets is heated to remove binder and temporarily burned, the obtained temporarily burned body is burned again, and the grain diameter of copper powder and ceramic powder are so set in grain diameter as to make the filling density of the mixed powder of copper powder and ceramic powder filled into the through-hole equal to or higher than the density of the glass-ceramic green sheet. |
