| 摘要 |
PURPOSE:To make cutting and eliminating tie bars unnecessary, and obtain a stable lead form, by using a lead frame without tie bars, and forming resin in gaps between a plurality of adjacent leads of said lead frame before it is resin sealed. CONSTITUTION:A semiconductor element is mounted on the element mounting part of a lead frame 10, and resin 4 is formed in gaps between a plurality of adjacent leads 2 after the element and lead tips are connected by using metal thin wires. Clamping is performed by using a resin seal metal mold, and resin sealing is performed by injecting sealing resin in the metal mold. Outer leads are subjected to sheathing process like solder plating, and formed in a specified shape. For forming the resin 4 in the gaps between a plurality of the adjacent leads 2 of the lead frame 10, thermosetting resin in a liquid state is dipped in the gaps between a plurality of the adjacent leads 2 of the lead frame 10, and cured by heated. Thereby an expensive press metal mold for cutting and eliminating tie bars is mode unnecessary, and a stable lead form can be obtained. |
