| 摘要 |
PURPOSE: To obtain easily the desired thickness of a lapping carrier for micro parts by stamping a plate material of less thickness than desired and controlling the thickness via the pressing of the material from upper and lower sides with molds having many needle projections. CONSTITUTION:A silicon steel plate is subjected to a stamping process with a press, thereby forming a lapping carrier 1 having some warp. This lapping carrier 1 is pressed on a base 8, using upper and lower metal molds 6 and 7 having many needle projections 9, and a lapping carrier 1' with roughness on both surfaces thereof is thereby formed. The roughness causes an increase in the apparent thickness 'H' of the lapping carrier 1', but this thickness 'H' is controlled by at least one of the number and the diameter of the needle projections 9, or a pressing force. As a result, a lapping carrier for machining a micro part of finished thickness such as about 0.32 mm can be easily controlled to a desired thickness by a unit of about 0.01 mm. |
