| 摘要 |
A stable one package etch-resistant film-forming composition is disclosed. The composition includes a polyepoxide component having an epoxy equivalent weight on resin solids of less than about 600. The composition further includes a polyacid curing agent having an average acid functionality of greater than 2. The composition is substantially free of basic esterification catalyst, has a cured softening point of greater than about 20 DEG C., and is stable for use as a single-component composition. Also disclosed is a process for applying a color-plus-clear composite coating to a substrate which includes applying a acid-catalyzed thermosetting film-forming composition to a substrate to form a basecoat. The process also comprises applying a stable etch-resistant film-forming composition to the basecoat which includes a polyepoxide and a polyacid curing agent as described above, wherein the topcoat is substantially free of basic esterification catalyst, has a cured softening point of greater than about 20 DEG C. The composition and process are useful in original equipment finishing of automobile and trucks. |
