| 摘要 |
<p>PURPOSE:To prevent deterioration of transmission characteristic of a high frequency signal due to an influence of capacitance element or inductance element of a lead and perfectly utilize the intrinsic high frequency characteristic of a semiconductor device itself by providing signal input/output terminals having a structure of a coaxial line of predetermined characteristic impedance. CONSTITUTION:A package for semiconductor device connect a high frequency signal input/output electrode among the electrodes provided on a semiconductor chip 1 mounted on an island 2 of the lead frame and a coaxial lead 3 of the coaxial structure with a bonding wire 4 and is sealed with resin 5 for sealing. The coaxial lead 3 is formed including a center conductor, a dielectric material surrounding the center conductor and an external conductor. The coaxial lead 3 has a characteristic impedance for the matching with an impedance of external circuits. Therefore, impedance matching is carried out between the coaxial lead 3 as the high frequency signal input/output terminal and external circuits and thereby a semiconductor device shows perfect high frequency characteristic.</p> |
