发明名称 |
IMPROVEMENT IN BONDING GLASS CERAMICS TO COPPER |
摘要 |
Disclosed is a method for promoting adhesion of cofired copper-based metallurgy and glass-ceramic dielectric including the step of adding powders of an alloying metal to the copper-based metallurgy prior to firing. Also disclosed is a metallizing paste exhibiting superior adhesion to glass-ceramics. The paste includes an organic carrier, copper powder and an alloying metal, which may be a non-copper metal powder or a copper-metal alloy. It is preferred that of the metal in the paste, the copper should make up 80-99 weight percent and the alloying metal should make up 1-20 weight percent. |
申请公布号 |
JPH04367575(A) |
申请公布日期 |
1992.12.18 |
申请号 |
JP19920019891 |
申请日期 |
1992.02.05 |
申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
NUNJIO DEIPAORO;ANANDA HOSAKERE KUMARU;RABERU BERII UIGINZU |
分类号 |
C03C17/06;C03C27/04;C04B37/02;H01B1/02;H01L21/48;H01L23/498;H05K1/09;H05K3/46 |
主分类号 |
C03C17/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|