发明名称 PLASTIC MOLDING DEVICE
摘要 PURPOSE:To make the title device into a plastic molding device, which can reduce a time necessary for heating of a mold as short as possible and heat the mold evenly. CONSTITUTION:A heating plate 3 is heated at a target temperature or higher, a plastic basic material is put into a cavity 2 of a mold 1 heated up to a temperature not exceeding its thermal deformation temperature and clamped down. The heating plate 3 is brought into contact with the mold 1 with fixed pressure and the heating plate 3 is removed after the mold 1 is heated so that temperatures of the central part and a surface part of the mold 1 become respectively not exceeding the target temperature and at least the target temperature. The whole of the mold is made the target temperature in several minutes by reducing the temperature of the surface part by leaving the mold 1 as it is cool while reheating the mold 1 under a state where the heating plate 3 is separated from the mold 1 and fixed resin inner pressure is generated into the cavity 2. The mold 1 is cooled gradually while keeping the temperature on, mold break is performed at a temperature where the resin inner pressure under thermal deformation temperature or lower becomes equal with atmospheric pressure and a molded product to which a mirror face is transferred is obtained.
申请公布号 JPH04366608(A) 申请公布日期 1992.12.18
申请号 JP19910168893 申请日期 1991.06.13
申请人 RICOH CO LTD 发明人 OSEKO HISAAKI
分类号 B29C45/00;B29C59/02;B29C69/02;B29C71/02;B29L11/00 主分类号 B29C45/00
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