| 摘要 |
PURPOSE:To perform polishing of the polishing surface of a lapping surface plate in a uniform flat state by forming a plurality of hole ports for inserting a work in a carrier and inserting a pseudo-work in the hole part for insertion in a spot positioned facing the protrusion-form surface of the polishing surface of the lapping surface plate, intended to be corrected, in a correcting device for a lapping surface plate for a wafer. CONSTITUTION:A plurality of hole parts 1a for inserting a work are formed in a disc-form carrier 1 in a state to be distributed uniformly throughout a whole. A disc-shape pseudo-work 2 made of cast iron is inserted in the hole part 1a for inserting a work in a portion positioned facing a protrusion-form part 3b of a polishing surface 3a of a lapping surface plate to be polished to perform polishing Namely, for example, when the central part of the lapping surface plate 3 and the inner and outer peripheral parts thereof are in a state like the protrusion-form part 3b, the hole parts 1a for inserting a work formed in the peripheral edge of the carrier 1 are used. |
