| 摘要 |
PURPOSE:To improve operation rate by permitting a bonding stage to have a vertical double structure whose top lead frame carrying path is used for lead frame bonding and the bottom lead frame carrying path is used for passing a bonded lead frame forward. CONSTITUTION:When bonding is not completed, a bonding stage is descended as a bonding stage 101 and a lead frame 121 is inserted into a top stage to be aligned. When clamping is completed, the bonding stage is ascended and bonding of the lead frame 121 is carried out. When bonding is completed, the bonding stage 101 is descended, the lead frame 121 is carried to a lead frame carrying rail 131 and is carried to the subsequent bonding stage entrance. A check sensor 152 checks the completion of bonding, the lead frame 121 passes through the bottom stage of a lead frame 122 and is ejected to the subsequent lead frame carrying rail. |
