| 摘要 |
<p>A notch of a semiconductor wafer is accurately and efficiently chamfered by the use of an apparatus which comprises a rotary disk grindstone, a wafer retaining mechanism for disposing the surface of a wafer so as to intersect the surface of the grindstone, a first drive mechanism capable of rotating the wafer within a prescribed range of angle around the central axis perpendicular to the main surface of the wafer thereby continuously positioning the surface of a notch of the wafer subjected to grinding relative to the grinding surface of the grindstone and effecting required grinding, a second drive mechanism capable of causing the grindstone and wafer to be relatively moved forward and backward in the radial direction of the grindstone, a third drive mechanism capable of causing the grindstone and wafer to be relatively moved forward and backward in the direction of thickness of the wafer, and a profiling mechanism capable of relatively guiding the notch and grindstone and consequently chamfering the notch in the circumferential direction and/or in the direction of thickness thereof. The profiling mechanism is provided with a reference plate corresponding in shape at least to the notch of the wafer and a disk corresponding in shape to the grindstone and permitting positional adjustment. <IMAGE></p> |
