| 摘要 |
PURPOSE:To identify the growing direction of material ingot between respective wafer by forming the cross-section of innercircumferential edge of ID blade asymmetrically between the front and rear faces thereby providing warp in predetermined direction to the sliced wafer. CONSTITUTION:The innercircumferential endface 12 of ID blade or an annular core metal 11 is machined not perpendicularly but obliquely against the board face to be asymmetrical between the front and rear. The diamond grains are secured through electrodeposition along the innercircumferential face to form the grinding wheel section 13 where the cross-section of the edge 14 is made oblique with correspondence to the cross-section of core metal 11. When slicing material ingot by means of said core metal 11 to produce a wafer, the lateral component F' of the cutting resistance will bend the blade or the core metal 11 to warp the sliced wafer in predetermined direction against the material ingot. |
