| 摘要 |
PURPOSE:To enable a conductor pillar which transmits signals between an integrated circuit and an insulating board to be protected against disconnection by a method wherein the conductor pillars which electrically connect the integrated circuit to the board wiring of the insulating board are partially or all connected together in parallel. CONSTITUTION:An multilayer interconnection section 3 is provided with conductor pillars 10 which reach its back side in contact with an insulating board from its surface where an integrated circuit 4 is mounted. The conductor pillars 10 are electrically connected to the integrated circuit 4 and a board wiring 5 of an insulating board 2, and the conductor pillars 10 connected to the integrated circuit 4 and the other pillars 10 connected to the board wiring 5 are optionally and electrically connected together with a conductor film 8. At this point, I/O vias 11 connected to the board wiring 5 of the insulating board 2 are connected together in parallel through the conductor pillars 10 provided to the multilayer interconnection section 3. Therefore, I/O vias can be protected against conduction failure. |
