| 摘要 |
<p>PURPOSE:To automatically execute a dicing treatment even to indefinite-shape wafers whose shape is different by a method wherein the size, the shape and the position of a wafer which has been held are detected, an optimum alignment operation is executed on the basis of their detection and the wafer is cut properly by using a prescribed blade which is equipped. CONSTITUTION:Regarding a wafer 6 mounted on a frame 9, its size, its shape, its number and its mounting position are detected by using a first detection means 2 on an X-Y axis matrix, e.g. on an X-Y axis matrix which is constituted of 256X256 picture elements of a CCD camera. Information detected in this manner is stored in a control part 1 as a data; on the basis of the data, each wafer is aligned precisely by using a second detection means 3; a cutting stroke is specified. As a result, even wafers whose pattern matching operation has been impossible and whose size and shape are different can all be diced automatically and properly, and an operation property is enhanced.</p> |
