| 摘要 |
PURPOSE:To obtain a lead frame, for integrated circuit use, wherein its shape can be recognized quickly and surely in a wire bonding operation and to obtain its manufacturing method. CONSTITUTION:A stepped part 20 which is provided with a sharp corner part 21 is formed in at least one part in a lead frame 1. The stepped part 20 is formed by stamping a part between a die-pad suspension lead 9 aand an inner lead 3 adjacent to it by performing two or more processes. |
