| 摘要 |
PURPOSE:To provide a laser beam machining method for a thin film body by which the damage of an organic film is small, concerning the laser beam machining method for the thin film body which is the organic film with an inorganic metal layer formed on it. CONSTITUTION:In the material to be worked 5 which is the organic film 7 with the metal layer 6 formed on it, in case either the thickness of the metal layer 6 is 2000Angstrom or more or the thickness of the organic film 7 is 3mum or less, by irradiating with the laser beam whose pulse width is 300ns or less and whose wavelength is 0.4-2mum, the heat damage of the organic film is reduced. |
