| 摘要 |
PURPOSE:To easily remove a defective chip by a method wherein the defective chip found on an electron sheet by an inspection is transferred on an adhesive tape located between the chip and an object lens and it is wound up at the prescribed pitch. CONSTITUTION:The ring 3, whereon an electron sheet 2 having expanded and aligned chips 1 is set, is placed on the measuring stand 4 of a visual inspection device, an inspection is performed by shifting the stand 4, a signal is given when a defective chip is present, a stand 11 is shifted by the functioning of a motor 16, an adhesive tape 10 is inserted between the object lens of a microscope 5 and the defective chip, a needle 13 is thrusted up by a cam mechanism and the defective chip is transposed on the adhesive tape. Then the motor 3 functions and the tape 10 is wound around a reel 9 at a prescribed pitch, the stand 11 retreats and the tape 10 goes out of the visual field. In this constitution, the defective chip can be removed without giving damage to the adjoining chip, and the selecting efficiency and yield rate can be improved. |
