| 摘要 |
PURPOSE:To miniaturize the chip of LSI without changing the total number of required parts by arranging rows of pads on the innermost area as viewed from the outer periphery of the chip. CONSTITUTION:Bonding wires 4-1, 4-2 are successively welded to corresponding pads 3-11, 3-12 using an exclusive machine, the length of the bonding wires being specified. The inner side pad rows are arranged in the positions so that the bonding wires 4-1, 4-2 may reach the inside of a chip 1 to be welded to the pads 3-11, 3-12. Next, the outside pad rows can be formed on the chip periphery side of the pad rows. Through these procedure, the pads 3-11, 3-12, 3-21, 3-22 can be arranged on the inner side when viewed from the periphery of the chip 1 and in the concentric positions when viewed from the chip center in multiple rows so that the chip may be miniaturized in the optimum state respectively with respect to the scale of the integrated circuit and the pad arrangement number. |
