| 摘要 |
PURPOSE:To provide a double-side polishing device capable of performing such double-side polishing as to suppress the in-plane thickness dispersion of a work piece to the submicron order. CONSTITUTION:A carrier 21-1 with silicon wafers supported thereon is auto- rotated while revolving by the rotation of a sun gear 4 and an internal gear 5, in the state of being held between an upper and a lower polishing surface tables 2, 3. This carrier 21-1 is formed of a main carrier member 22 and a substantially ring-shape sub-carrier member 23-1 with its outside fitted to the main carrier member 22 and its inside supporting the silicon wafers 7. |
