| 摘要 |
<p>PURPOSE:To prevent the misalignment of a resin package and height fluctuation of leads when the package is mounted on a printed circuit board by making the bottom of the package manufactured in a resin sealing process flat. CONSTITUTION:The bottom of a resin package 5 manufactured in a resin sealing process is made flat by removing the bottom 8a of the package 5 by grinding. As a result, the misalignment of the semiconductor package caused by defective temporary fixing and defective soldering caused by the height fluctuation among leads 3 can be prevented in a process for mounting the package on a printed wiring board 7. In addition, semispheric projections 11 which support the package 5 together with each lead 3 are provided on the bottom of the package 5. Therefore, when the projections 11 come into contact with the board 7 at the time of mounting the package 5 on the board 7, a fixed clearance is formed between the bottom of the package 5 and substrate 7 and the height of the package is fixed to a prescribed value after mounting.</p> |
