发明名称 LEADFRAME FIXING EQUIPMENT
摘要 The lead frame fixture is composed of a rectangular main frame (21) in the center, a number of fixtures (22), a finger (23) for securing the lead frame, a rocking part (26) for fixing the secured lead frame, and a hot plate (30) for preheating the lead frame. The hot plate is made of a fix die (32) symmetrically set up at a movable bar (31), and a moving bar (33) connected with the movable bar. The rocking part on the lead frame fixture and the moving bar are coupled with the movable bar. A pin (24) the height of which is constant is provided at the end of the finger so that the lead frame can be securely seated on the finger.
申请公布号 KR920010758(B1) 申请公布日期 1992.12.14
申请号 KR19890017561 申请日期 1989.11.30
申请人 HYUNDAI ELECTRONICS CO., LTD. 发明人 NO, KIL - SOP
分类号 H01L23/48;(IPC1-7):H01L23/48 主分类号 H01L23/48
代理机构 代理人
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